Wireless Module
We supply electronic components primarily to original equipment manufacturers (OEMs) in a diverse
and growing range of industries, including manufacturers of computer-related products, wireless and other
communications products, GPS tracking devices, consumer goods, point-of-sale equipment, etc.
Our technical professionas are ready to serve you.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
Our W900 is embedded with Qualcomm QCS8250. The System-on-Chip (SoC) brings the latest technologies in a highly integrated chipset that delivers maximum performance with exceptional features. This chip is purpose-built for enterprise and commercial IoT applications such as video collaboration, smart camera, connected healthcare, smart retail and more.
Chipset: SDM636
Powerful system performance, multi-media, LTE Cat 6,
Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Chipset：SDM450
Powerful performance, support multi-media LTE Cat 6,Wi-Fi 802.11ac, BT& GNSS
The Cinterion BGS2 module is the most successful 2G LGA
wireless module in the market offering full voice capabilities,
high speed GPRS data transmission and best-in-class low
power consumption.
Chipset: SDM8909
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM8916
Entry-level SoC chipset, support multi-media, LTE Cat 4, Wi-Fi 802.11n, BT and GNSS
Chipset: SDM660
Powerful performance, support multi-media, LTE Cat 6, Wi-Fi (2 x 2 MIMO/ 802.11ac), BT and GNSS
Quectel RM510Q-GL is a 5G module that is specially optimized for IoT/eMBB applications. Adopting 3GPP Release 15, it supports both 5G NSA and SA modes.
Quectel RG50xQ is a series of 5G Sub-6 GHz LGA modules optimized specially for IoT and M2M applications. Adopting the 3GPP Rel-15 technology, it delivers maximum data rates up to 2.5 Gbps downlink and 900 Mbps uplink.
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